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Embedded Packaging Comes of Age
By Risto Tuominen, Imbera Electronics
The demand for improved functionality within smaller spaces in the electronics arena is straining existing semiconductor and SiP packaging technologies. Several novel technology approaches are being developed to increase product miniaturization and performance. During recent years, component embedding inside PCB motherboards and substrates has generated a lot of attention and is seen as one of the most promising technology solutions for future.


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Reducing and Preventing Tin Corrosion Whiskers
By Olaf Kurtz, Ph.D.; Peter Kühlkamp; Jürgen Barthelmes; and Robert Rüther, Atotech Deutschland GmbH
For the connector and IC/leadframe industries, corrosion can occur on metalized components and products, resulting in malfunctions. This article presents the work done on an effective anti-corrosion treatment* that can mitigate corrosion whisker formation effectively. Process benefits to tin solderability are highlighted.

SMT Live videos tour the global electronics assembly and PCB manufacturing industries.


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From The Wires
Logitech Ships 1B Computer Mouse
Business Wire (December 3, 2008)
Stats ChipPAC Adds to QFN Portfolio
10Meters.com (December 3, 2008)
Altium Debuts Designer Update
Market Wire (December 3, 2008)
EMRISE Wins $1.2M Order for ...
Business Wire (December 2, 2008)
Camtek, Raytex Collaborate on Wafer AOI
Knobias.com (December 2, 2008)
Federal Electronics Earns ...
PR Newswire (December 2, 2008)
Green Handsets Research
Business Wire (December 1, 2008)
Plexus Adds Teradyne ICT Station
Business Wire (November 30, 2008)
EADS, IBM, Dassault Collaborate ...
Business Wire (November 26, 2008)
Emrise Wins $1M Entertainment ...
Business Wire (November 25, 2008)
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Manncorp Debuts Benchtop Production Line
 
(December 2, 2008) SAN DIEGO, Calif. and WILLOW GROVE, Pa. — The "Starter Lab" turnkey line from Manncorp targets low-cost precision prototyping or low-volume SMT assembly. It also is used by technical schools ...

  Research Report: EMS Rankings in Europe
 
(December 2, 2008) MONTREAL — Electronics.ca Publications released "The European EMS Industry: An Analysis of the Top 50 European EMS Providers," providing an overview of the major European EMS providers. ...

Participate in APEX 2009
 
(December 1, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries is inviting researchers, academics, technical experts, and industry leaders to submit abstracts for poster presentations ...

  Saki To Acquire MacroScience to Expand AOI and X-ray
 
(December 1, 2008) Japan and Hong Kong — Japanese AOI manufacturer Saki Corporation signed a sale and purchase agreement with Schmidt Electronics, an Asia-Pacific conglomerate of advanced electronics and ...

Henderson Evaluates Computer Sector
 
(December 1, 2008) LOS ALTOS, Calif. — Modest PC prospects are forecast for 2009, according to the Henderson Forecast Summary from Henderson Ventures. The analyst firm also sees falling average selling prices ...

  Names in the News
 
Following are the new Websites, events, and personnel appointments from around the electronics industry's supply chain. News is featured from NEPCON China, Electronic Interconnect Technology (EI), DYMAX Corporation, ...

October PCB Results Maintain Level
 
(November 25, 2008) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries announced that the book-to-bill for rigid PCBs dropped incrementally to 0.95; the overall PCB book-to-bill results ...

  Supplier Quality Doesn't Just Happen
 
By Robert Rowland, RadiSys
Supplier quality management is a critical success factor, especially when commodities are procured globally and manufacturing is outsourced. Selection, qualification and approval, ...

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Sponsored White Papers Library
Recently Added White Papers

Conductive Film for RF Grounding Can Take the Heat (11/21/2008, Henkel Corporation)

New Corrosion-Resistant Conductive Adhesive for Consumer Applications Delivers Cost-efficient Alternative to Current Technologies (10/07/2008, Henkel Corporation)

Understanding Lead-Free Solder Joint Shear Performance (09/05/2008, Henkel Corporation)

Flux gets its FillNew Epoxy Flux Material Offers Underfill Protection (06/04/2008, Henkel Corporation)

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Featured White Papers

Conductive Film for RF Grounding Can Take the Heat (11/21/2008)
 
Choosing the Right Solder Paste (05/20/2008)

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Columns
Editor’s View
How Can We Benefit from What’s Happening in Solar?

SMT Advisory
The Integrated Circuit Turns 50

 
QuickVote
Which consumer electronic is most likely to buck the spending cutbacks and post high sales volumes this holiday season?
Flat-panel TVs.
Smartphones.
Ultra-portable computers.
Personal media players.
None of these will win over consumers.


View Results



Upcoming Events
Transitioning to Lead-free -- Strategies for Implementation
December 8 -10, 2008
Dallas, TX
 

Configuration Tech Webinar
December 9, 2008
Online
 

VISIBILTY- Cornerstone of Business Intelligence
December 9, 2008
Online
 

First Annual FPGA Summit
December 9 -12, 2008
San Jose, CA
 

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