SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities to Strengthen Domestic Semiconductor Supply Chain
April 9, 2024 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the construction of Taiwan Semiconductor Manufacturing Company (TSMC) chip manufacturing facilities in Arizona. The award includes $6.6 billion grants, as much as $5 billion in loans and an investment tax credit.
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas. “This CHIPS and Science Act award is a key stride towards a 2-nanometer process, positioning the United States to produce the most advanced semiconductor chips at scale in order to advance global supply chain stability and help meet worldwide chip demand across various markets.”
“This grant increases TSMC's total investment in Arizona to $65 billion and is expected to create over 25,000 direct construction and manufacturing jobs, further demonstrating the positive economic impact and job creation potential of such advancements in semiconductor manufacturing,” Stockunas said. “Government investments like the CHIPS and Science Act grant for TSMC play a crucial role in semiconductor manufacturing and are of immense importance to economies globally.”
The recently announced SEMI 300mm Fab Outlook to 2027 report projects the Americas region will double 300mm fab equipment investments from US$12 billion in 2024 to US$24.7 billion in 2027, significantly narrowing the gap with the top three spending regions, which are projected to invest between US$26.3 billion and US$30 billion in chipmaking equipment in 2027.
Suggested Items
KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024
05/14/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
05/13/2024 | SEMIThe 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.
NEOTech Positions Itself as Microelectronics Industry Leader with High-Technology Investments
05/09/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, announces a significant investment in acquiring new Palomar 8100 wire bonder machines, enhancing the company’s positioning as a leader of cutting-edge microelectronics assemblies for mission-critical applications.
MKS Instruments Reports Q1 2024 Financial Results
05/09/2024 | MKS Instruments, Inc.MKS Instruments, Inc., a global provider of enabling technologies that transform our world, reported first quarter 2024 financial results.