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High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

Sondrel Poised to Support the Evolution of Intelligent Cars with Ultra-Complex Chips

04/08/2024 | Sondrel
According to Sondrel, a leading provider of ultra-complex chips, the designing of Software Defined Vehicles (SDVs) is changing the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features.

SIA Applauds CHIPS Act Incentives for Intel Projects

03/20/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Intel Corporation.

SIA Commends CHIPS Act Incentives for GlobalFoundries Projects

02/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.

RTX's Collins Aerospace Facility in the Philippines Now Operating Fully on Renewable Electricity

02/20/2024 | RTX
Collins Aerospace, an RTX business, announced its facility in Tanauan City, Philippines is now operating on 100% renewable electricity. The site, which is part of Collins' Interiors business, manufactures galleys and galley inserts, lavatories, seating and oxygen systems for commercial aircraft.
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